Industry: Manufacturing Region: UK Transaction price: US$ 1 million Transaction method: equity investment
Project introduction:
The company focuses on advanced spraying technology, and its high target utilization sputtering technology is used for:
Semiconductor and display: wafer-level metallization (8-inch substrate), MicroLED electrode coating;
New energy: buffer layer of perovskite battery, solid electrolyte deposition of solid battery;
Optics and industry: AR/VR optical filter, tool wear-resistant coating, decorative metal coating;
Advanced packaging: high aspect ratio through-hole seed layer plating instead of electroplating pretreatment.
The company can provide flexible solutions from research and development to mass production:
On the R&D end: modular design supports rapid process development and can be integrated into clustering tools to realize multi-material stacking;
At the mass production end: it has been successfully applied to the roll-to-roll coating production line, and the distance between target and substrate can be reduced to 5cm, which improves the deposition efficiency by 30%;
In addition, the company can also provide customized cooperation: cooperate with global enterprises to develop ferromagnetic target sputtering process (such as cobalt alloy) and break through the traditional technical limitations.
Cooperation mode:
At present, the company is looking for potential buyers to sell.