Industry: Electronics Region: Germany Transaction price: US$ 1 million Transaction method: equity investment
Project introduction:
A German company, founded more than 20 years ago, initially engaged in the business of unpackaged semiconductors, specializing in supplying data and telecommunications markets. In the past twenty years, the company has expanded its technology portfolio in all aspects, and has developed into a market leader in high-mixing, small-batch optoelectronic components, specializing in the development and industrial production of complex microelectronics and optoelectronic modules to complete systems. The annual turnover is about 70 million euros. Meet the specific needs of global customers in the fields of medical technology, industry and automation, data and telecommunications, semiconductors and aerospace.
Technical advantages:
The company can provide a wide range of high-end chip-level technology combinations in clean room (ISO 5, ISO 7 and ISO 8) environments. Including chip and wire bonding, flip chip, optical packaging, SMT- surface mount technology, wafer back-end service.
Can process all common substrates, such as standard printed circuit boards (rigid and flexible), foils, ceramics, silicon wafers, glass or IMS.
Multi-chip module (MCM) can realize complete functions and sub-circuits as a package system (SIP). Support the concept of modularization, which helps to reduce production costs. The company realized a highly integrated component with multiple I/O in a module with limited space, which is an efficient solution to save costs.
Cooperation mode:
Seek partners who need to develop and produce complex optoelectronic and microelectronic modules in China.