Industry: Microelectronics Region: France Transaction price: US$ 1 million Transaction method: equity investment
Project introduction:
A French company, relying on the mature microelectronics industry ecology in southern France, is committed to providing complete solutions from technology development to large-scale production for semiconductor and electronic system enterprises. The core advantage of the enterprise lies in mastering the key technologies of advanced packaging and independent production capacity, and can realize the industrialization of complex technologies such as ultra-thin electronic modules, high-density interconnection and heterogeneous integration. Enterprise services cover chip design enterprises, system integrators and terminal manufacturers, which can effectively support the development of electronic products in the direction of miniaturization, high performance and high reliability.
Enterprises provide services.
1. Advanced packaging technology
Provide advanced packaging process development and mass production services, including high-density packaging structure design, chip packaging integration and high-reliability electronic module manufacturing, to help customers improve product performance and integration.
2. High density interconnection solution
Support the integration of different types of chips, functional modules and material systems, and meet the requirements of a new generation of electronic products for high-speed transmission, low power consumption and high integration.
3. Ultra-thin electronic module
It has the development ability of ultra-thin carrier, flexible substrate and embedded electronic module, and can be applied to smart cards, wearable devices, Internet of Things terminals and portable electronic products.
Cooperation mode:
Looking for partners who need advanced packaging and integration technology in microelectronics, integrated circuits, Internet of Things and other industries.